详细介绍
产品名称:选择性波峰焊SE4050
Product Name:Selective wave soldering SE4050

1.设备描述Equipment Description
设备针对电子PCB焊接的高精度要求,具有灵活的参数调整功能,适合在需要高效、精准的自动化生产线上使用;
The equipment is designed for the high-precision requirements of electronic PCB welding, with flexible parameter adjustment functions, suitable for use in automated production lines that require high efficiency and precision;
设备运输方向为左向右,运输带通行宽度60-410mm支持电动调节,承载重量最大可达8kg,轻松适应各种尺寸的PCB板,极大提升生产灵活性,确保精确平稳的传输;
The transportation direction of the equipment is from left to right, and the passing width of the transportation belt is 60-410mm, which supports electric adjustment, and the load capacity can be up to 8kg, which can easily adapt to various sizes of PCB boards, and greatly enhance the flexibility of the production, and ensure accurate and smooth transmission;
支持0.8-2.0mm厚度的PCB板,适用于各类电子元器件焊接。无论是标准电路板还是特殊设计的产品,都能提供最优的焊接效果;
Support 0.8-2.0mm thickness PCB board, suitable for all kinds of electronic components welding. Provides optimal soldering results for both standard circuit boards and specially designed products;
锡炉温度可调节至270-320°C,预热温度80-150°C,焊接过程精准可控,避免过热或焊接不良;
The temperature of the soldering furnace can be adjusted to 270-320°C and the preheating temperature is 80-150°C. The soldering process can be precisely controlled to avoid overheating or bad soldering.
配备高精度定位系统,X、Y、Z轴定位精度高达±0.15mm,焊接精度高,满足精细化电子产品的需求;
Equipped with high-precision positioning system, X, Y, Z-axis positioning accuracy of up to ± 0.15mm, high welding precision, to meet the needs of fine electronic products;
焊接速度高达10mm/s(X、Y轴),2-10mm/s(Z轴),短时间内完成高效焊接,提升生产效率,缩短生产周期;
Welding speed up to 10mm/s (X, Y axis), 2-10mm/s (Z axis), short time to complete efficient welding, improve productivity and shorten production cycle;
焊点与焊点之间的距离≤2mm,焊盘与焊盘之间的距离要求<0.6mm,适合密集布局的电路板;
The distance between solder joints and solder joints is ≤2mm, and the distance between pads and pads is required to be <0.6mm, which is suitable for densely laid out circuit boards;
采用智能功率调节技术,总功率仅20KW,运行功率约为5-8KW,最大程度降低能耗,提升工作效率;
Adopting intelligent power adjustment technology, the total power is only 20KW, and the running power is about 5-8KW, which minimizes energy consumption and improves work efficiency;
氮气纯度高达99.998%,气源稳定,确保焊接过程中的气氛恒定,避免氧化,提升焊接质量。
Nitrogen purity up to 99.998%, stable gas source, to ensure a constant atmosphere during the welding process, to avoid oxidation, to enhance the quality of welding.
2.技术参数Technical Parameters
·设备尺寸:2450*1730*1650mm
Equipment size: 2450*1730*1650mm
·运输方向:左向右
Direction of transportation: left to right
·过板宽度:60-410mm(可调)
Overboard width: 60-410mm (adjustable)
·过板长度:120-510mm
Overboard length: 120-510mm
·PCB板上通行高度:120mm
Passing height on PCB: 120mm
·PCB板下通行高度:30mm
PCB underpass height: 30mm
·轨道最大载重:8KG
Maximum rail load: 8KG
·运输带调整方式:电动调节,前方固定导轨运输带
Transportation belt adjustment: electric adjustment, front fixed rail transportation belt
·预热区上/下长宽:上:760*460mm/下:760*500mm
Preheating area upper/lower length and width: upper: 760*460mm/lower: 760*500mm
·轨道距地高度:900±25mm
Height of rail from the ground: 900±25mm
·Z轴最大行程:55mm
Maximum stroke of Z-axis: 55mm
·Z轴升高至板底后到喷嘴距离:1-1.5mm
Z-axis elevated to the bottom of the plate to the nozzle distance: 1-1.5mm
·玻璃门可开启高度:2060mm
Glass door openable height: 2060mm
·预热气压:0.5兆帕左右
Preheating air pressure: about 0.5 MPa
·设备总功率:20KW
Total power of equipment: 20KW
·设备运行功率:5-8KW
Equipment operating power: 5-8KW
·电源要求:三相五线制 380V
Power requirements: three-phase five-wire 380V
·空气源要求:0.6-1Mpa
Air source requirement: 0.6-1Mpa
·氮气源要求:2m³/h
Nitrogen source requirement: 2m³/h
·氮气纯度:99.998%
Nitrogen Purity: 99.998%
·抽风量:600-1000cbm/h
Pumping volume: 600-1000cbm/h
3.工艺参数Process parameters
·锡炉温度:270-320℃
Tin furnace temperature: 270-320°C
·预热温度:温度范围:80-150℃,升温时间:30-120s
Preheating temperature: temperature range: 80-150℃, heating time: 30-120s
·最大焊接波峰高度:5mm
Maximum welding crest height: 5mm
·最小边间隙:3mm
Minimum side clearance: 3mm
·X Y轴定位速度:0.5-200mm/s
X Y-axis positioning speed: 0.5-200mm/s
·X Y Z轴定位精度:±0.15mm
X Y Z axis positioning accuracy: ±0.15mm
·X Y轴焊接速度:10mm/s
X Y-axis welding speed: 10mm/s
·Z轴焊接速度:2-10mm/s
Z-axis welding speed: 2-10mm/s
·Z轴定位速度:20mm/s
Z-axis positioning speed: 20mm/s
·运输速度:0.2-200mm/s
Transportation speed: 0.2-200mm/s
·喷嘴尺寸:3-6 4-8 6-10 8-12 10-14
Nozzle size: 3-6 4-8 6-10 8-12 10-14
·轴焊线直径:2-125mm
Shaft welding wire diameter: 2-125mm
·元器件脚长:0.8-2.0mm
Component foot length: 0.8-2.0mm
·焊点与焊点间距离:≤2mm
Distance between soldering point and soldering point: ≤2mm
·焊盘与焊盘间距离:<0.6mm以上
Distance between pad and pad: <0.6mm or more
·焊接角度:3-5°
Welding angle: 3-5°
·预热气压:0.3兆帕左右
Preheating air pressure: about 0.3 MPa
·焊接高度:要求Z轴升起后达到板底距离1-1.5mm左右
Welding height: the Z-axis is required to reach the bottom of the plate at a distance of about 1-1.5mm after lifting.
·助焊剂喷涂量:0.05-0.2ML
Flux Spray Volume: 0.05-0.2ML
·焊点的焊接时间:3-10s
Soldering time of solder joints: 3-10s
·氮气耗量:5-20L/min
Nitrogen consumption: 5-20L/min
·PCB厚度:0.8-2.0mm
PCB thickness: 0.8-2.0mm



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